| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a hotplate unit which can prevent a semiconductor wafer position shift by sucking and fixing the semiconductor wafer on a ceramic plate. SOLUTION: The hotplate unit is composed of a ceramic plate either on or inside of which, a heating resistor is formed, and a supporting container supporting the ceramic plate. Through holes to suck the semiconductor wafer put on the ceramic heater are formed to the ceramic plate, and a suction means sucking the air inside the supporting container is installed to the supporting container.</p> |
