| 摘要 |
PURPOSE:To enhance an insulating property by a method wherein, before a resin sealing operation, a lead part of a lead frame is sandwiched and held between metal molds and both faces are sandwiched and held between stepped pins on which a prescribed springy force acts. CONSTITUTION:Before a resin sealing operation, a lead part 1a of a lead frame 1 is sandwiched and held between upper and lower metal molds 5a, 5b; and the face on the element-mounting side of the lead frame 1a and its opposite face are sandwiched and held between one pair of stepped pins 7a, 7b on which forces of springs 8a, 8b act. When a resin 4 is injected into the metal molds 5a, 5b in this state, the molding pressure of the resin 4 acts on stepped parts of the pins 7a, 7b, the pins 7a, 7b are separated from the lead frame 1 and a prescribed gap is formed between the lead frame 1 and the pins 7a, 7b. The resin 4 flows into the gap, and parts other than the lead part 1a are resin-sealed. Thereby, it is possible to enhance the insulating property of a device. |
