METHOD FOR MANUFACTURING HIGH-FREQUENCY LAMINATED COMPONENT

摘要

PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer electrode.

SOLUTION: A recess 11 is formed at a position in contact with an inner-layer electrode 1 on the lower surface of a laminated sheet 2 laminated onto the laminated sheet 2 having the inner-layer electrode 1, thus accommodating the inner-layer electrode into the recess and hence improving the flatness in the high-frequency laminated component.

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