发明名称 REINFORCED SUBSTRATE DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a connector connection that can avoid substrate breakage at a low cost, with reference to a reinforced substrate device that enables reinforced connection with a circuit substrate, particularly at the time of connector installation. <P>SOLUTION: The reinforced substrate device is combined with a fragile substrate (100) including a signal trace (202), a reinforced plate (102) bonded to the fragile substrate and the reinforced plate, and has a surface mounting connector (104) electrically connected to the signal trace. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004363610(A) 申请公布日期 2004.12.24
申请号 JP20040165824 申请日期 2004.06.03
申请人 AGILENT TECHNOL INC 发明人 WONG MARVIN GLENN
分类号 H01R12/71;H01R43/20;H05K1/02;H05K1/03;H05K3/00;(IPC1-7):H05K1/02;H01R12/22 主分类号 H01R12/71
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