| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device wherein its substrate and cover member are so bonded surely to each other even when using different members from each other as its substrate and cover member so as to prevent their exfoliations and bonding faultinesses, etc. <P>SOLUTION: The optical semiconductor device M has a base member 1 and a glass window material 2. A recessed portion 15 is so formed in the base member 1 as to provide a photodiode 4 in the recessed portion 15. The glass window material 2 transmits a blue light. Also, the glass window material 2 is bonded to the top surface of a wall 12 of the base member 1 via a bonding agent 3, and the one of the type of curing at an ordinary temperature is used as the bonding agent 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
