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发明名称
切断装置及切断方法
摘要
本发明使被施加张力且包含有固定研磨粒之细线,朝向一个方向高速行走。又,使固定在左侧载台及右侧载台之树脂填封体与细线相对性地移动。藉此,因使细线与树脂填封体接触而切断树脂填封体。于树脂填封体所具有的一个列状领域,首先,细线之一部分即垂直部沿着包含曲线或折线部分的切断线而弯曲状地移动以切断树脂填封体。接着,垂直部沿着仅由直线部分(线段)构成之切断线直线状地移动而切断树脂填封体。如此一来,列状领域所包含之各领域可分割成各个封装体。
申请公布号
TW200814175
申请公布日期
2008.03.16
申请号
TW096125999
申请日期
2007.07.17
申请人
TOWA股份有限公司
发明人
前田启司;北田良二;中野纪敏;田头史明
分类号
H01L21/304(2006.01)
主分类号
H01L21/304(2006.01)
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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