发明名称 METHOD AND DEVICE FOR REFLOW SOLDERING WITH VOLUME FLOW CONTROL
摘要 According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.
申请公布号 KR100814999(B1) 申请公布日期 2008.03.18
申请号 KR20067010537 申请日期 2006.05.30
申请人 发明人
分类号 H01L21/60;B23K1/008;H05K3/34 主分类号 H01L21/60
代理机构 代理人
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