| 摘要 |
Methods of termination bonding for producing lead type electrical components such as a multilayer capacitor 200. The components are placed in a lead frame 400 mounting tab and support 402, 406 with termination paste (210, fig.3) applied to selected portions of the component, preferably the components are un-terminated and the paste is dried but not fired. Firing of the assembled electrical components in the lead frame which causes the electrical components to be concurrently terminated and provided with strongly secured leads. Alternatively the electric components may be of resistive or inductive types. Preferably the frame is of copper or silver material and the paste of a metal/glass/organic material. |
