CUTTING METHOD OF FRAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress the burr occurring in the section of a frame due to stamping. SOLUTION: This cutting method of the frame comprises: the first step of forming a stamping portion having a first curve R1 in a part of the external shape according to the stamping; and the second step of cutting a part of the frame by making a cutting edge 31s abut along a cutting line 31 including a second curve intersecting the first curve R1 to connect it to the stamping portion. A manufacturing method of a semiconductor device according to the present invention is characterized by comprising the step for cutting a part of the frame by the cutting method of the frame. COPYRIGHT: (C)2008,JPO&INPIT