| 摘要 |
A mould (110) with a protruding pattern (110a, 110b) is provided that is pressed into a thin polymer film (112, 312) via an imprinting process. Controlled connections between nanowires (118, 318) and microwires (116, 316) and other lithographically-made elements of electronic circuitry are provided. An imprint stamp is configured to form arrays of approximately parallel nanowires which have (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in the Y direction, and three or more distinct heights (12a, 12b, 12c) in the Z direction. The stamp thus formed can be used to connect specific individual nanowires (118, 318) to specific microscopic regions of microscopic wires (116, 316) or pads. The protruding pattern (110a, 110b) in the mould (110) creates recesses (112a, 112b) in the thin polymer film (112, 312), so the polymer layer acquires the reverse of the pattern on the mould (110). After the mould (110) is removed, the film is processed such that the polymer pattern can be transferred on a metal/semiconductor pattern on the substrate (114, 314). |
