SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, STACKED MODULE, CARD, SYSTEM AND METHOD OF THE SEMICONDUCTOR DEVICE

摘要

A method of manufacturing the semiconductor device and semiconductor device, semiconductor package, stack module, card, system are provided to improve the heat spreading efficiency of the semiconductor device. The semiconductor substrate(105) has the first side and the second side. One or more conducting pads(120) is arranged in the constant area on the first side. One or more dummy pads(110) is arranged on the first side or the second side. It is not electrically connected to one or more conducting pads and it is used for the heat transmission. The connection line connects a plurality of dummy pads.