发明名称 A SURFACE TREATMENT APPARATUS AND PROCESS FOR STAMP
摘要 <p>An apparatus for treating stamp surface and a method thereof are provided to uniformly treat a stamp surface of a large area used for large size substrate manufacture by including a heating part capable of hardening a chemical liquid. A jig(5) is installed in a chamber(10), and arranges one or more stamp(1) inside the chamber. A chemical liquid supply part(20) is installed in one side of the chamber, and supplies a chemical liquid to an inner part of the chamber. A heating part(40) is installed in one side of the chamber. The chemical liquid absorbed on a stamp surface by the heating part is hardened. The jig is composed of a plurality of supporting poles, and forms a plurality of load parts in which the stamp is loaded. A plurality of supporting poles is separated with a constant interval, and circulates the chemical liquid.</p>
申请公布号 KR100887529(B1) 申请公布日期 2009.03.06
申请号 KR20070133939 申请日期 2007.12.20
申请人 DMS CO., LTD. 发明人 JUNG, CHANG HO;LEE, JIN HYANG;YANG, JAE YOUNG;PARK, CHUN SEONG
分类号 H01L21/027 主分类号 H01L21/027
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