| 摘要 |
A test tray (TST) is provided with a plurality of inserts (82) wherein IC devices can be stored, and a frame member (81) for movably holding the inserts (82). Each insert (82) is arranged to the frame member (81), in a direction substantially orthogonally intersecting with the main surface of the test tray (TST). The inserts (82) are arranged to be stacked on the frame member (81), along a direction substantially orthogonally intersecting with the main surface of the test tray (TST). |
