Stacked packaged integrated circuit devices, and methods of making same

摘要

A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another. A method is also disclosed which includes conductively coupling a plurality of extensions on a leadframe to each of a pair of stacked packaged integrated circuit devices and cutting the leadframe to singulate the extensions from one another.

主权项

1. A device, comprising:
a first packaged integrated circuit device; a second packaged integrated circuit device positioned above the first packaged integrated circuit device; and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another, wherein each of the plurality of conductive members has an outer edge that is substantially aligned with an outer edge of at least one of the first and second packaged integrated circuit devices.