| 发明名称 | Systems and methods for bonding semiconductor elements | ||
| 摘要 | A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. | ||
| 申请公布号 | US9362247(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201514822164 | 申请日期 | 2015.08.10 |
| 申请人 | Kulicke and Soffa Industries, Inc. | 发明人 | Chylak Robert N.;DeAngelis Dominick A. |
| 分类号 | H01L23/00;H01L25/10;H01L25/03;H01L25/00 | 主分类号 | H01L23/00 |
| 代理机构 | Stradley Ronon Stevens & Young LLP | 代理人 | Stradley Ronon Stevens & Young LLP |
| 主权项 | 1. A method of ultrasonically bonding semiconductor elements, the method comprising the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures, further comprising the step of deforming ones of the first conductive structures during step (b). | ||
| 地址 | Fort Washington PA US | ||