Wire tail connector for a semiconductor device

摘要

A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.

主权项

1. A memory device, comprising:
a substrate including a plurality of contact pads; one or more semiconductor die including a plurality of die bond pads; a molding compound applied on the substrate and encapsulating the one or more semiconductor die, the molding compound and substrate together forming a flat planar surface upon singulation of the molding compound and substrate together, a contact pad of the plurality of contact pads having a severed edge exposed at the flat planar surface of the molding compound; and an external connection provided on one or more surfaces of the molding compound for electrically coupling the contact pad with a die bond pad of the plurality of die bond pads.