发明名称 |
Data storage device and methods of manufacturing the same |
摘要 |
Provided are data storage devices and methods of manufacturing the same. The device may include a plurality of cell selection parts formed in a substrate, a plate conductive pattern covering the cell selection parts and electrically connected to first terminals of the cell selection parts, a plurality of through-pillars penetrating the plate conductive pattern and insulated from the plate conductive pattern, and a plurality of data storage parts directly connected to the plurality of through-pillars, respectively. The data storage parts may be electrically connected to second terminals of the cell selection parts, respectively. |
申请公布号 |
US9362225(B2) |
申请公布日期 |
2016.06.07 |
申请号 |
US201514598228 |
申请日期 |
2015.01.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Song Jungwoo;Lee Jaekyu |
分类号 |
H01L23/528;H01L23/522;H01L29/423;H01L27/108;H01L27/11;H01L27/10;H01L27/105;H01L27/22;H01L45/00;H01L27/24;H01L27/02 |
主分类号 |
H01L23/528 |
代理机构 |
Muir Patent Law, PLLC |
代理人 |
Muir Patent Law, PLLC |
主权项 |
1. A data storage device comprising:
a plurality of cell selection parts formed in a substrate; a plate conductive pattern covering the cell selection parts, the plate conductive pattern electrically connected to first terminals of the cell selection parts; a plurality of through-pillars penetrating the plate conductive pattern, the plurality of through-pillars insulated from the plate conductive pattern; and a plurality of data storage parts connected to the plurality of through-pillars, respectively, wherein the data storage parts are electrically connected to second terminals of the cell selection parts, respectively, wherein the plate conductive pattern has a plurality of plate holes; wherein the plurality of through-pillars pass through the plurality of plate holes, respectively; and wherein the plate holes are spaced apart from each other and form an array of plate holes. |
地址 |
Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do KR |