| 发明名称 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | ||
| 摘要 | Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die. | ||
| 申请公布号 | US9362208(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201514821550 | 申请日期 | 2015.08.07 |
| 申请人 | Micron Technology, Inc. | 发明人 | Schwab Matt E.;Brooks J. Michael;Corisis David J. |
| 分类号 | H01L21/44;H01L21/48;H01L21/50;H01L23/492;H01L23/16;H01L23/31;H01L25/065;H01L23/36;H01L23/00 | 主分类号 | H01L21/44 |
| 代理机构 | Perkins Coie LLP | 代理人 | Perkins Coie LLP |
| 主权项 | 1. A method for processing a semiconductor wafer, comprising: attaching a support structure to the semiconductor wafer; cutting the semiconductor wafer and the support structure into individual semiconductor dies with attached individual support members that are portions of the support structure, wherein individual support members include a first plate, a second plate, and a plurality of heat conducting fins between the first and second plates; attaching a substrate to at least one support member, the substrate having a connection site for electrically connecting the substrate to the semiconductor die; and at least partially encapsulating the semiconductor die, the support member, and the substrate in an encapsulant. | ||
| 地址 | Boise ID US | ||