| 发明名称 | Electronic device and method for manufacturing same | ||
| 摘要 | An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections. | ||
| 申请公布号 | US9362202(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201414279979 | 申请日期 | 2014.05.16 |
| 申请人 | FUJITSU LIMITED | 发明人 | Baba Shunji;Fukuzono Kenji;Hoshino Yuki |
| 分类号 | G06F1/16;G06F1/20;H05K5/00;H05K7/00;H01L23/473;H01L21/48;H05K1/02 | 主分类号 | G06F1/16 |
| 代理机构 | Staas & Halsey LLP | 代理人 | Staas & Halsey LLP |
| 主权项 | 1. An electronic device comprising: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; a resin filled between the support member and the electric component among the plurality of connections; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being embedded in the resin. | ||
| 地址 | Kawasaki JP | ||