| 摘要 |
The present invention relates to a halogen-free thermosetting resin composition, a prepreg using the same, and a lamination plate for printed circuit. The halogen-free thermosetting resin composition includes: (A) 30-60 parts by weight of a halogen-free epoxy resin, (B) 5-30 parts by weight of phosphorus-containing bisphenol as a first hardening agent, (C) 5-30 parts by weight of alkylphenol alkylphenol novolac as a second hardening agent, and (D) and a phosphorus-containing flame retardant with respect to 100 parts by weight of organic solid. The prepreg and the lamination plate for printed circuit which are produced by the halogen-free thermosetting resin composition of the present invention show high glass transition temperature, excellent dielectric performance, low absorption rate, high heat resistance, and favorable processability, and ensures halogen-free flame retardance while flame retardant level reaches the level of UL94 V-0. |
