发明名称 |
Heat spreading substrate |
摘要 |
Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials. |
申请公布号 |
US9390998(B2) |
申请公布日期 |
2016.07.12 |
申请号 |
US201213399952 |
申请日期 |
2012.02.17 |
申请人 |
Invensas Corporation |
发明人 |
Mohammed Ilyas;Wang Liang;Guevara Gabriel Z. |
分类号 |
H01L23/62;H01L23/373 |
主分类号 |
H01L23/62 |
代理机构 |
Forefront IP Lawgroup, PLLC |
代理人 |
Forefront IP Lawgroup, PLLC |
主权项 |
1. An apparatus comprising:
a thermally conductive, electrically insulating solid; a first electrically conductive coating mechanically coupled to a first edge of said solid; a second electrically conductive coating mechanically coupled to a second edge of said solid; wherein said first and said second electrically conductive coatings are electrically isolated from one another; and wherein faces of said first electrically conductive coating, said second electrically conductive coating and said solid are substantially coplanar. |
地址 |
San Jose CA US |