METHOD OF MANUFACTURING A CIRCUIT DEVICE

摘要

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

主权项

1. A method of manufacturing a circuit device, comprising:
providing a lead frame comprising a plurality of leads, each of the leads comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion, mounting circuit elements on upper surfaces of the island portions; connecting the circuit elements to corresponding bonding portions by wirings wherein one of the plurality of leads is a first input lead adapted to be connected to a positive electrode side of a direct-current power source, another of the plurality of leads is a second input lead adapted to be connected to a negative electrode side of the direct-current power source, and yet another of the plurality of leads is an output lead through which alternating-current power obtained by converting direct-current power inputted through the first input lead and the second input lead is adapted to be outputted; attaching lower surfaces of the island portions to an upper surface of a circuit board; and encapsulating by a resin the circuit board, the circuit elements and the lead frame so that the lead portions are not covered by the resin.