| 发明名称 |
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME |
| 摘要 |
A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate. |
| 申请公布号 |
US2016211188(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201514808596 |
申请日期 |
2015.07.24 |
| 申请人 |
SK hynix Inc. |
发明人 |
LEE Dae Woong;KANG Tae Min;BAE Han Jun |
| 分类号 |
H01L23/29;H01L23/31;H01L21/56;H01L23/00 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
an adhesive member disposed on a package substrate to have a trapezoid cross-section view; and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member, wherein the semiconductor chip has a first surface and a second surface facing the first surface, wherein the second surface of the semiconductor chip contacts the adhesive member, and wherein the semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate. |
| 地址 |
Icheon-si Gyeonggi-do KR |
