发明名称 |
BONDING METHOD AND SYSTEM FOR FLEXIBLE DISPLAY DEVICE |
摘要 |
A bonding method for a flexible display device, the method including arranging at least two bonding objects and an anisotropic conductive film (ACF) at a bonding position; applying a predetermined pressure to the at least two bonding objects and the ACF; and irradiating a laser beam at the bonding position to bond the at least two bonding objects and the ACF, a temperature and viscosity of the ACF being changed, and a change of the temperature following a predetermined temperature profile. |
申请公布号 |
US2016218289(A1) |
申请公布日期 |
2016.07.28 |
申请号 |
US201514811883 |
申请日期 |
2015.07.29 |
申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
LEE Chung-Seok;BEOM Jin Gab |
分类号 |
H01L51/00;H01L51/56 |
主分类号 |
H01L51/00 |
代理机构 |
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代理人 |
|
主权项 |
1. A bonding method for a flexible display device, the method comprising:
arranging at least two bonding objects and an anisotropic conductive film (ACF) at a bonding position; applying a predetermined pressure to the at least two bonding objects and the ACF; and irradiating a laser beam at the bonding position to bond the at least two bonding objects and the ACF, a temperature and viscosity of the ACF being changed, and a change of the temperature following a predetermined temperature profile. |
地址 |
Yongin-City KR |