| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device is provided including a package substrate, and a plurality of semiconductor chips stacked above the package substrate, at least one of the plurality of semiconductor chips including a step part in a periphery edge part of a rear surface, |
| 申请公布号 |
US2016218086(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201614994963 |
申请日期 |
2016.01.13 |
| 申请人 |
J-DEVICES CORPORATION |
发明人 |
MODA Makoto |
| 分类号 |
H01L25/065;H01L23/538;H01L23/00;H01L23/367 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a package substrate; and a plurality of semiconductor chips stacked above the package substrate, at least one of the plurality of semiconductor chips includes a step part in a periphery edge part of a rear surface. |
| 地址 |
Oita JP |
