| 发明名称 |
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE |
| 摘要 |
A method of manufacturing a fan out wafer level package comprises: preparing conductive projections on an upper surface of a chip; mounting the chip on a carrier with the upper surface of the chip facing upwards; plastic packaging the chip to form a plastic packaging body with tops of the conductive projections being disposed outside the plastic package body; and implementing a redistribution line processing on the plastic package body. With this method, chips can be made small and thin and the manufacturing processes can be simplified. |
| 申请公布号 |
US2016218020(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201514927199 |
申请日期 |
2015.10.29 |
| 申请人 |
National Center for Advanced Packaging Co., Ltd. |
发明人 |
WANG Hongjie;LIU Yibo;CHEN Feng;SHANGGUAN Dongkai;SUN Peng |
| 分类号 |
H01L21/56;H01L23/482 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a fan out wafer level package, comprising:
preparing conductive projections on an upper surface of a chip; mounting the chip on a carrier with the upper surface of the chip facing upwards; plastic packaging the chip to form a plastic packaging body with tops of the conductive projections being disposed outside the plastic package body; and implementing a redistribution line processing on the plastic package body. |
| 地址 |
Wuxi CN |
