发明名称 Embedded carbon-doped germanium as stressor for germanium nFET devices
摘要 Carbon-doped germanium stressor regions are formed in an nFET device region of a germanium substrate and at a footprint of a functional gate structure. The carbon-doped germanium stressor regions are formed by an epitaxial growth process utilizing monomethylgermane (GeH3—CH3) as the carbon source. The carbon-doped germanium stressor regions that are provided yield more strain in less volume since a carbon atom is much smaller than a silicon atom.
申请公布号 US9419138(B2) 申请公布日期 2016.08.16
申请号 US201414500345 申请日期 2014.09.29
申请人 International Business Machines Corporation 发明人 Dittmar Jeffrey L.;Fogel Keith E.;Naczas Sebastian;Reznicek Alexander;Sadana Devendra K.
分类号 H01L21/336;H01L29/78;H01L29/66;H01L21/8238;H01L29/16 主分类号 H01L21/336
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C. ;Morris, Esq. Daniel P.
主权项 1. A method of forming a semiconductor structure, said method comprising: providing a gate structure on a topmost surface of a germanium substrate and in an nFET device region of said germanium substrate; and forming a source-side carbon-doped germanium stressor region on one side of said gate structure, and a drain-side carbon-doped germanium stressor region on another side of said gate structure, wherein said forming said source-side carbon-doped germanium stressor region and said drain-side carbon-doped germanium stressor region comprises an epitaxial growth process utilizing monomethylgermane as a carbon source and wherein no silicon atoms are incorporated into said source-side carbon-doped germanium stressor region and said drain-side carbon-doped germanium stressor region.
地址 Armonk NY US