发明名称 |
Embedded carbon-doped germanium as stressor for germanium nFET devices |
摘要 |
Carbon-doped germanium stressor regions are formed in an nFET device region of a germanium substrate and at a footprint of a functional gate structure. The carbon-doped germanium stressor regions are formed by an epitaxial growth process utilizing monomethylgermane (GeH3—CH3) as the carbon source. The carbon-doped germanium stressor regions that are provided yield more strain in less volume since a carbon atom is much smaller than a silicon atom. |
申请公布号 |
US9419138(B2) |
申请公布日期 |
2016.08.16 |
申请号 |
US201414500345 |
申请日期 |
2014.09.29 |
申请人 |
International Business Machines Corporation |
发明人 |
Dittmar Jeffrey L.;Fogel Keith E.;Naczas Sebastian;Reznicek Alexander;Sadana Devendra K. |
分类号 |
H01L21/336;H01L29/78;H01L29/66;H01L21/8238;H01L29/16 |
主分类号 |
H01L21/336 |
代理机构 |
Scully, Scott, Murphy & Presser, P.C. |
代理人 |
Scully, Scott, Murphy & Presser, P.C. ;Morris, Esq. Daniel P. |
主权项 |
1. A method of forming a semiconductor structure, said method comprising:
providing a gate structure on a topmost surface of a germanium substrate and in an nFET device region of said germanium substrate; and forming a source-side carbon-doped germanium stressor region on one side of said gate structure, and a drain-side carbon-doped germanium stressor region on another side of said gate structure, wherein said forming said source-side carbon-doped germanium stressor region and said drain-side carbon-doped germanium stressor region comprises an epitaxial growth process utilizing monomethylgermane as a carbon source and wherein no silicon atoms are incorporated into said source-side carbon-doped germanium stressor region and said drain-side carbon-doped germanium stressor region. |
地址 |
Armonk NY US |