发明名称 Mold and mildew stain removing solution
摘要 A solution having improved mold and mildew stain removing properties on hard surfaces, that is easier to handle (less corrosive and less malodorous) and that is environmentally friendly. The mold and mildew stain removing solution includes the following components: a surfactant selected from the group consisting of alcohol ethoxylates, alkyl sulfates, alkyl ether sulfates, alpha olefin sulfonates, alkyl phosphates, alkyl amidopropyl betaines, alkyl betaines, amphoacetates, amphoproprionates, amphosulfonates, amine oxides, alkanolamides, sulfosuccinates, and sultaines, a solvent, and at least one chelating agent. The solution may further comprise a hydrotrope, a diluent, a preservative, and/or a fungicide. The surfactant is preferably an alcohol ethoxylate. The hydrotrope is preferably lauramine oxide. The solvent is preferably a glycol ether. The chelating agents are preferably sodium gluconate and a solution of the trisodium salt of methyl glycine diacetic acid.
申请公布号 US9434910(B2) 申请公布日期 2016.09.06
申请号 US201313694898 申请日期 2013.01.16
申请人 Jelmar, LLC 发明人 Gaudreault Rosemary
分类号 A61K33/00;C11D1/825;C11D3/48;C11D3/20;C11D3/33;A61L2/00;A61L2/18;A61L2/16;C11D1/72;C11D1/75 主分类号 A61K33/00
代理机构 Greenberg Traurig, LLP 代理人 Greenberg Traurig, LLP
主权项 1. A mold and mildew stain removing solution comprising: a surfactant selected from the group consisting of alcohol ethoxylates, alkyl sulfates, alkyl ether sulfates, alpha olefin sulfonates, alkyl phosphates, alkyl amidopropyl betaines, alkyl betaines, amphoacetates, amphoproprionates, amine oxides, alkanolamides, sulfosuccinates, and sultaines, wherein the surfactant comprises about 1 wt. % to about 8 wt. % of the solution; an amine oxide hydrotrope, wherein the hydrotrope comprises about 1 wt. % to about 5 wt. % of the solution; a glycol ether solvent, wherein the solvent comprises about 0.5 wt. % to about 5 wt. % of the solution; a first chelating agent, wherein the first chelating agent is sodium gluconate comprising about 0.25 wt. % to about 3 wt. % of the solution; and a second chelating agent, wherein the second chelating agent is a salt of methyl glycine diacetic acid comprising about 0.1 wt. % to about 1.25 wt. % of the solution, wherein the pH of the mold and mildew removing solution ranges from about 9.2 to about 9.6.
地址 Skokie IL US