发明名称 PACKAGING STRUCTURE FOR DRIVING CIRCUIT IN LIQUID CRYSTAL DISPLAY DEVICE OR THE LIKE
摘要 PURPOSE:To improve the reliability and durability in dealing with finer patterns and size reduction by subjecting the respective connections of the input terminal parts on an electrode substrate of a liquid crystal display body, etc., and an IC for driving as well as a control circuit board to wire bonding or face down packaging. CONSTITUTION:The output wiring between a liquid crystal display body and the IC 2 for driving is formed by face down packaging and the output wiring between the liquid crystal display body 3 and the IC 2 for driving is executed by wire bonding packaging at the time of the packaging of the driving device of the liquid crystal display device consisting of the liquid crystal display body 3, etc., formed by sealing the liquid crystal between a pair of the glass substrates having transparent electrodes on the inside surfaces, a control member, such as driving control circuit 4, etc., for controlling this body, and the IC 2 for driving which is used for driving the liquid crystal display body 3 and, the input of which exists on one side and the output of which exists on the one side opposite thereto. The sufficient dealing with the fine patterning or the size reduction is possible in this way and the reliability and durability are improved.
申请公布号 JPH04116625(A) 申请公布日期 1992.04.17
申请号 JP19900237350 申请日期 1990.09.07
申请人 SEIKO EPSON CORP 发明人 SAKURA SEIICHI;KAMIMURA MASARU
分类号 G02F1/1345;G02F1/13;H01L21/60;H01L23/538 主分类号 G02F1/1345
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