| 摘要 |
The invention relates to the wet-chemical treatment of the surfaces (5) of material (6). It is suitable, in particular, for the accelerated treatment of structures as are found, for example, in printed-circuit-board technology. For this purpose, pulse-like jets (4) of the treatment liquid are produced and directed against the surface of the material. This gives rise to pronounced impact action against the base of the structures which are to be processed, as a result of which the amount of treatment time which is necessary is substantially reduced. The pressure-free and accelerated outflow of the treatment liquid from the structure channels in the pauses between pulses results in the flanks of the structures or circuit-board conductors being subjected to less wet-chemical processing than in the prior art, which is a further aim of the invention. Thus, for example, in the case of chemical etching over a given treatment period, a smaller amount of undercutting takes place or, with the same amount of undercutting taking place, the treatment period can be substantially reduced. |
