| 摘要 |
<p>PURPOSE:To miniaturize the picture device and to prevent the rise of temperature caused by the heating of a driving device by taking out a switching circuit outside a drum and preventing the heat of the switching circuit from conducted to the drum. CONSTITUTION:A lead 14 is taken out through a hole 20 equipped with a housing 2 and a throughhole 22 equipped with a second substrate 16 to connect to the substrate 16 with a soldering or the like. When the substrate is divided into two and folded by the F type lead 14, the width occupied by the substrate is reduced and a printer head is miniaturized. A switching circuit 18 is arranged outside the housing 2, and the heat on a light emitting diode array 12 is reduced to approximately one third. The housing 2 and the second substrate 16 are connected by the heat insulating layer such as pressure sensitive adhesive double coated tape to make the heat insulation complete.</p> |
