| 摘要 |
An interconnection package is provided for a circuitry component, such as an integrated circuit, comprising a support member for supporting the circuitry component and an interconnect member placed over the circuitry component. The interconnect member has interconnect transmission lines on at least one surface for transmitting currents and signals to and from the circuitry component. When the package is to contain a monolithic microwave integrated circuit (MMIC), millimeter waveguides are employed to transmit RF signals to and from the MMIC through the package. The MMIC is positioned in cavities in the support member and the interconnect member is placed over the MMIC. RF interconnect transmission lines on the interconnect member can be connected directly to RF contact pads on the MMIC or can be electromagnetically coupled. DC interconnect transmission lines are connected directly to DC contact pads on the integrated circuit. Use of the support member and the interconnect member provides a total of three levels on which to dispose interconnect transmission networks, including cross-overs, and peripheral circuit components. |
