发明名称 METHOD OF FEEDING LEAD-FREE STICK SOLDER TO SOLDER TANK AND SOLDER TANK.
摘要 <p>[PROBLEMS] Mixing of lead into a lead-free solder tank must be absolutely avoided. Even when the shape of lead-free stick solder is differentiated from that of lead-containing stick solder, in the event of disposing of a lead-containing stick solder in the vicinity of the solder tank, it has happened that the lead-containing stick solder is put in the solder tank. [MEANS FOR SOLVING PROBLEMS] The solder tank at its superior part is provided with a passage part through which any lead-free stick solder with configuration different from that of lead-containing stick solder can pass but any lead-containing stick solder cannot pass. At the time of inputting in the solder tank, the inputting is performed through the passage part.</p>
申请公布号 MX2008007715(A) 申请公布日期 2009.05.11
申请号 MX20080007715 申请日期 2007.06.19
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 NAKAMURA, HIDEKI
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