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发明名称
Verfahren zum Herstellen von Halbleiterscheiben gleichmaessiger Dicke durch mechanische Oberflaechenbearbeitung
摘要
申请公布号
DE1577469(A1)
申请公布日期
1970.05.06
申请号
DE19661577469
申请日期
1966.05.24
申请人
SIEMENS AG
发明人
HERBERT LANGE,DR.-ING.;BOEHM,WALTER
分类号
B24B37/04;H01L21/302
主分类号
B24B37/04
代理机构
代理人
主权项
地址
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