发明名称 |
Solder coating equalisation |
摘要 |
The printed circuits which have been hot-tinned thicker than required are freed from the excess solder by passing them through a pre-pickling stage where an equalizer fluid is sprayed over them and where they are preheated, followed by a stage where a spray melts the existing coating and forms a uniform and equalized coating. The circuits are cleaned in a last stage and the fluid remnants are discharged. |
申请公布号 |
DE1923058(A1) |
申请公布日期 |
1970.05.27 |
申请号 |
DE19691923058 |
申请日期 |
1969.05.06 |
申请人 |
ELECTROVERT MANUFACTURING CO.LTD. |
发明人 |
V. TARDOSKEGYI,LOUIS;A. ELLIOTT,DONALD |
分类号 |
C23C26/02;H05K3/34 |
主分类号 |
C23C26/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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