发明名称 Solder coating equalisation
摘要 The printed circuits which have been hot-tinned thicker than required are freed from the excess solder by passing them through a pre-pickling stage where an equalizer fluid is sprayed over them and where they are preheated, followed by a stage where a spray melts the existing coating and forms a uniform and equalized coating. The circuits are cleaned in a last stage and the fluid remnants are discharged.
申请公布号 DE1923058(A1) 申请公布日期 1970.05.27
申请号 DE19691923058 申请日期 1969.05.06
申请人 ELECTROVERT MANUFACTURING CO.LTD. 发明人 V. TARDOSKEGYI,LOUIS;A. ELLIOTT,DONALD
分类号 C23C26/02;H05K3/34 主分类号 C23C26/02
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