| 摘要 |
An aluminum coating is applied to a flat surface of a body of semiconductor material. The body having at least two zones or regions of different or opposite type conductivity exposed at the flat surface. A surface of a metal support or contact member which is to be joined to the aluminum coated surface of the semiconductor body is coated with a silicon-aluminum alloy. The two surfaces are then brought together and the surfaces heated to a temperature just above the silicon-aluminum eutectic whereby the body of semiconductor material is joined to support or contact. |
