| 摘要 |
1,144,671. Semi-conductor devices. ASSOCIATED SEMICONDUCTOR MFRS. Ltd. 27 May, 1966, No. 23967/66. Heading H1K. A header for an integrated circuit or other semi-conductor device comprises a moulded bottom wall and side wall 2 of insulating material which define an enclosure, an isolated metal pad 5 (to which the semi-conductor device is to be bonded) moulded in the insulating material and situated at the base of an internal depression in the bottom wall, and a plurality of metal connecting leads 6 moulded in the side wall 2 and insulated from the metal pad 5 by the insulating material, the leads 6 extending into the enclosure and having exposed end portions 9 situated therein higher than the metal pad 5. The upper surface of the side wall 2 may have moulded thereto a metal frame 8 to which a lid is subsequently soldered, and the leads 6 may initially take the form of teeth projecting from a frame 7 which is severed after assembly of the header, this assembly being effected under heat and pressure in a jig (Fig. 4). The insulating material may be a borosilicate glass, and the metal parts may be of a nickel/iron/oobalt alloy with the exposed portions coated with gold by means of electroless plating. |
