| 摘要 |
PURPOSE:To reduce a relative moving distance between a chuck mechanism to take out a chip-shaped electronic component and a package by a method wherein when a chip shaped electronic component series, which has a tape shape, is pulled out, a winding core which is rotatably held by first and second wall materials is rotated. CONSTITUTION:On a first wall material 11, an expanded part 17 which provides a recessed part 16 to store a chip-shaped electronic component series 2 which is wound around a winding core 10 is formed. The forming of such an expanded part 17 is performed by embossing process. On the expanded part 17, a first bearing hole 18 which receives a first circular stage part 14 of the winding core 10 rotatably, and a window 19 from which the chip shaped electronic component series 2 is pulled out are formed. On a second wall material 12, a second bearing hole 20 which receives a second circular stage part 15 of the winding core 10 rotatably is formed. Also, the second wall material 12 is joined to the first wall material 11 in such a manner that the second wall material 12 closes the opening of the recessed part 16 formed on the first wall material 11. For the joining, e.g. heat-welding is used. |
