| 摘要 |
<p>PURPOSE:To eliminate a defect in solder plating by arranging a cathode so as to come in contact with the inclination of each lead, whereby a power supply to all leads is assured even though the leads of a semiconductor device are different in height from one another. CONSTITUTION:A contact portion of a cathode 7 is arranged so as to come in contact with the inclination of each lead. In this instance, the contact portion of the cathode 7 has a steeper inclination than each lead 1b. Thus, the arrangement, in which the cathode 7 makes contact with the inclination of the lead in order to supply power to each lead through the inclination, assures a contact between all leads 1b and the cathode 7. In clamping each lead 1b, only a small amount of force is required within the range of an elastic deformation of the lead, thereby eliminating a break in the lead.</p> |
