| 摘要 |
PURPOSE:To improve operability when a flexible board material is bent to be soldered and reliability of soldered joint by forming a plurality of slits on the surface of the material at the opposite side to the surface formed with leads. CONSTITUTION:A bending region 25a formed with an output side outer lead 25 on a flexible board material 21 is to be bent longitudinally of the material 21 so as to form a small-sized liquid crystal panel unit by connecting the panel to a printed circuit board through a chip 22, and a plurality of slits are formed on the material 21 of the region 25a along its bending direction. Slits 32a-32c are formed on the surface of the material 21 at the opposite side to the surface formed with a conductor pattern 31 between adjacent conductor patterns 21 of the region 25a. The slit 32a is an example which is not passed through the material 21, and the slits 32b, 32c, as shown, are passed through the material 21. |
