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发明名称
METHOD OF FORMING THROUGH HOLE AT MULTIILAYER PRINTED CIRCUIT BOARD BY LASER BEAM
摘要
申请公布号
JPS556809(A)
申请公布日期
1980.01.18
申请号
JP19780078045
申请日期
1978.06.29
申请人
发明人
分类号
H05K3/00;B23K26/00;B23K26/38;H05K3/46
主分类号
H05K3/00
代理机构
代理人
主权项
地址
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