| 摘要 |
PURPOSE:To obtain the extremely compact and inexpensive thermal head by providing slits or hollow parts in the lead electrode of the extremely compact thermal head, thereby facilitating the connection between the head and a flexible circuit. CONSTITUTION:A tantarum nitride film is attached on an alumina substrate 5 on which partial glaze is formed by magnetron sputtering, and Cr-Cu-Cr layers are evaporated on said film. A photoetching method is used for a heating part and electrodes 3 and 4. An oxidation resisting layer of SiO2 and an abrasion resisting layer of Ta2O5 are attached on the upper part of the head at the part A except for a soldering part. Then the device is put in a solder bath and solder 3 is attached by a dipping method. The head is connected to the flexible circuit 7 by applying heat from the bottom and applying pressure from the top. In this constituion, even through the solder leaks to the slit parts 6, the quantity of leakage is not so large as the quantity shown by the Figure. The short circuit to other electrodes, which has occured in the conventional circuits, does not occur, and the yield rate of the connection between the head and the flexible circuit becomes 100%. |
