| 摘要 |
NEW MATERIAL:A compound shown by the formula I (X is terminal functional group; Ar1 and Ar2 are aromatic residue; R1 is H or 1-10C alkyl; R2 is H, 1-20C alkyl, alkoxy or OH; n is 0-30 integer). USE:An improver for heat resistance, mechanical characteristics and solvent resistance of epoxy resin, phenolic resin, etc. PREPARATION:An aromatic diamine and a compound shown by the formula II are subjected to a common imidation reaction in the case wherein X is -NH2 or an aromatic monoamine containing a functional group such as COOH, OH, SH, etc., and the compound shown by the formula II are subjected to the common imidation reaction in the case wherein X is -COOH, -OH, -SH, etc., to give a compound shown by the formula I. |
