发明名称 IC PACKAGE
摘要 <p>PURPOSE:To remarkably increase the strength of a clamping of a screw in case of clamping with a positioning hole by forming the size of the cutout of first layer ceramics in the same size as or slightly larger than the positioning hole opened in a read frame. CONSTITUTION:A hole 1 or cutout which is the same as or slightly larger than a positioning hole 2 opened in a lead frame is formed in a first layer ceramic plate. The positioning is performed with the hole 2 opened in the lead frame, and a screw is supported by the hole or the cutout of the first layer ceramic plate. Thus, the hole or cutout of the first layer ceramic plate is formed slightly larger than the positioning hole 2 opened in the lead frame to increase the strength of a clamping of the screw.</p>
申请公布号 JPS62183145(A) 申请公布日期 1987.08.11
申请号 JP19860024333 申请日期 1986.02.06
申请人 SEIKO EPSON CORP 发明人 TAKENAKA KAZUHIRO
分类号 H01L23/02;H01L23/00;H01L23/32 主分类号 H01L23/02
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