| 摘要 |
PURPOSE:To improve the reliability of a bonded portion of an external metal terminal by baking a film of a specific property electric insulation dense crystallized glass on a portion to which an external metal terminal of copper-plated portion is not bonded by brazing to form a fine wiring pattern of accurate size in high density. CONSTITUTION:Ti, Mo and Cu are sequentially deposited by sputtering in thicknesses of 0.2mum, 0.3mum, and 1.0mum on a sintered ceramic substrate 1 which contains 90wt% of alumina content to form a thin film interconnection pattern 2. A conductor plating 3 made of copper formed in the thickness of 5mum is formed on the pattern 2, and an external metal terminal 4 made of kovar for electrically connecting the interconnection in and out the sintered ceramic substrate 1 with an external circuit is disposed. Ag-brazing material 5 of 800 deg.C of bonding temperature is used to bond the plating 3 to the terminal 4. A film 6 of electric insulation dense crystallized glass of SiO2-BaO-ZnO crystallized glass having 900 deg.C or lower of baking temperature, 750 deg.C or higher of heat resistance temperature and 55-80X10<-7>cm/ deg.C of thermal expansion coefficient from ambient temperature to 400 deg.C is seized to a portion to which the terminal 4 of the plating 3 is not bonded. |
