| 摘要 |
PURPOSE:To omit a strength reinforcing GaAlAs substrate by providing a surface electrode and a rear-surface-part electrode on the upper surface and the rear surface of a double-heterojunction structure comprising a clad layer, an active layer and a window layer, and lining the entire rear surface with a conductive resin. CONSTITUTION:A surface electrode 1 and a rear electrode 7 are provided on the upper surface and the rear surface of a double-heterojunction structure comprising a clad layer 4, an active layer 3 and a window layer 2. A reinforcing conductive resin film 9 is formed on the rear surface. As the reinforcing conductive resin, a heat resisting resin paste containing noble metal powder can be used. As the resin paste, epoxy resin and polyimide based resin can be used. As the noble metal powder, silver powder, gold powder or the powder of alloy containing the silver powder and the gold powder can be utilized. Thus a strength reinforcing GaAlAs substrate can be omitted. |
