| 摘要 |
PURPOSE:To simplify the measurement of wire height and reduce the test time by measuring the peak height of wire and the height of wire at an edge of a chip where the wire should be out of touch to obtain the shape of bond wire. CONSTITUTION:A hybrid IC substrate 1 having a chip 2 and wiring pattern 6 is checked for the shape of a bond wire 5 on it. The shape of the wire 5 is evaluated by measuring the peak height of wire and the height of wire at an edge 21 of the chip 2 where the wire should be out of touch. For example, a reference height h0 is determined while a camera 7 is focused on the surface of a pad 3 on the chip 2. Next, the peak of wire is focused to determine the peak height h1 and the XY coordinates of the peak. Then, the camera is moved vertically, and the wire height h2 at the edge 21 of the chip is determined when the edge 21 is clearly focused. |
