| 摘要 |
A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2% tin, 0.5-3.5% silver, 0.1-2.8% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210 DEG -216 DEG C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders. |
