发明名称 Use of a cadmium-free silver alloy as low-melting hard solder
摘要 Cadmium-free hard solders having working temperatures of less than 630° C., which are easily workable and yield ductile soldered joints, are composed of 30 to 60% by weight of silver, 10 to 36% by weight of copper, 15 to 32% by weight of zinc, 0.5 to 7% by weight of gallium, 0.5 to 7% by weight of tin and 0 to 5% by weight of indium.
申请公布号 ZA9405008(B) 申请公布日期 1995.02.21
申请号 ZA19940005008 申请日期 1994.07.11
申请人 DEGUSSA AKTIENGESELLSCHAFT 发明人 WOLFGANG WEISE;WILLI MALIKOWSKI;DIETER KAUFMANN;HARALD KRAPPITZ
分类号 B23K35/30;C22C30/06 主分类号 B23K35/30
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