| 摘要 |
PURPOSE:To make a conductor line of a multilayer ceramic circuit board to have low resistance by setting up a circuit substrate on a holding means keeping a gap from a plurality of via positions existing on the under surface of this board for performing firing. CONSTITUTION:Slurry is applied on a carrier tape so as to make a green sheet having a thickness of 200mum. Then after forming via holes, W-paste is screen- printed for filling in via holes and patterning a conductor line. Such green sheets are laminated into thirty layers using a jig for being integrated by applying pressure and being placed on a holding means and fired in an N2 air current at 1700 deg.C for eight hours in order to form a multilayer ceramic board 3. Next, anoxidation Cu pellets 5 are placed on the vias 2 of this board for heat treatment in the N2 air current in order to diffuse Cu on the conductor line. Thereby, the resistance of a W-conductor is reduced to not exceeding 10mOMEGA/square. |
